Title:
OPTICAL MODULE AND CAN PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/134967
Kind Code:
A1
Abstract:
The present invention is provided with: a CAN package (2) having a stem (22) and lead pins (23a, 23b) protruding from the stem (22); and a substrate (3) having lead pin connecting pads (33a, 33b). The CAN package (2) has a groove (222) that is provided in a stem (22) surface from which the lead pins (23a, 23b) protrude, one end of the substrate (3) is inserted into the groove (222), and the lead pin connecting pads (33a, 33b) are electrically connected to the lead pins (23a, 23b).
Inventors:
ITAKURA HIROSHI (JP)
YAMAGISHI KEITARO (JP)
AKEBOSHI YOSHIHIRO (JP)
YAMAGISHI KEITARO (JP)
AKEBOSHI YOSHIHIRO (JP)
Application Number:
PCT/JP2017/001928
Publication Date:
July 26, 2018
Filing Date:
January 20, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01S5/022
Domestic Patent References:
| WO2007099612A1 | 2007-09-07 |
Foreign References:
| JP2003332667A | 2003-11-21 | |||
| JP2000353850A | 2000-12-19 | |||
| JP2013092689A | 2013-05-16 | |||
| US20030086243A1 | 2003-05-08 |
Attorney, Agent or Firm:
TAZAWA, Hideaki et al. (JP)
Download PDF:
Previous Patent: LASER DEVICE
Next Patent: METHOD FOR MANUFACTURING FEED CONTAINING SALMON GROWTH HORMONE, FEED CONTAINING SALMON GROWTH HORMON...
Next Patent: METHOD FOR MANUFACTURING FEED CONTAINING SALMON GROWTH HORMONE, FEED CONTAINING SALMON GROWTH HORMON...