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Patent Searching and Data


Title:
OPTICAL MODULE, IMAGE PICKUP MODULE, AND ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2018/092233
Kind Code:
A1
Abstract:
An optical module 1 is provided with: an optical element 30 having a light emitting section 31; a first wiring board 10, on which the optical element 30 is mounted, said optical element being on a first main surface 10SA; a ferrule 40 that is a holding member, which has a through hole H40, and which is disposed on a second main surface 10SB of the first wiring board 10; an optical fiber 50 inserted into the through hole H40 of the ferrule 40; a side surface wiring board 20, in which a third main surface 20SA is disposed parallel to an optical axis O, an end portion is connected to the first wiring board 10, and an electrode 21 is disposed on a fourth main surface 20SB; and a signal cable, a leading end portion of which is connected to the electrode 21 of the side surface wiring board 20.

Inventors:
SAKAI YOUHEI (JP)
MIYAHARA HIDEHARU
Application Number:
PCT/JP2016/084070
Publication Date:
May 24, 2018
Filing Date:
November 17, 2016
Export Citation:
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Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B1/04; G02B6/42; H01L25/065; H01L25/07; H01L25/18; H01L27/14; H04N5/225; H04N5/369; H04N7/18
Foreign References:
JP2014137584A2014-07-28
JPH04218136A1992-08-07
JPH0549602A1993-03-02
JP2008118568A2008-05-22
JP2015068835A2015-04-13
Attorney, Agent or Firm:
ITOH Susumu (JP)
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