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Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2014/192939
Kind Code:
A1
Abstract:
This optical module is provided with a base unit having a surface metal layer formed on the surface of a base, a semiconductor element placed on the surface metal layer of the base unit, and an optical element optically coupled with the semiconductor element. The optical element is adhered with an adhesive to the surface of the base on the side where the semiconductor element and the optical element are optically coupled, and the surface of the surface metal layer on the side where the semiconductor element and the optical element are optically coupled is provided in a position retracted from the surface of the base on the side where the semiconductor element and the optical element are optically coupled, forming a pullback region on the surface of the base. Between the adhesion region, where the base and the optical element are adhered together, and a mounting unit, which is positioned below the light output end surface of the semiconductor element, the surface metal layer has an adhesive flow-stop unit which is pattern-formed so as to prevent the adhesive from flowing over the pullback region towards the mounting unit. By this means, an optical module is provided which prevents adhesive from flowing into the optical coupling path.

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Inventors:
ISHIGE YUTA (JP)
HAYAMIZU NAOKI (JP)
Application Number:
PCT/JP2014/064501
Publication Date:
December 04, 2014
Filing Date:
May 30, 2014
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01S5/022
Foreign References:
JP2001116962A2001-04-27
JP2005347590A2005-12-15
JP2008053483A2008-03-06
JP2004214326A2004-07-29
JP2005057144A2005-03-03
JPH07147430A1995-06-06
JP2011513774A2011-04-28
JP2002359425A2002-12-13
JP2009239015A2009-10-15
JP2010278364A2010-12-09
US20060109882A12006-05-25
Attorney, Agent or Firm:
SAKAI, Hiroaki et al. (JP)
Hiroaki Sakai (JP)
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