Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2019/184100
Kind Code:
A1
Abstract:
Provided is an optical module, comprising a circuit board, an optical assembly, and an electrical interface. The circuit board is provided with a signal rate converter chip, a laser driver chip, a trans-impedance limiting amplifier chip, a vertical-cavity surface-emitting laser chip array, and a photodetector chip array. The signal rate converter chip is electrically connected to the laser driver chip and the trans-impedance limiting amplifier chip via first microstrip lines. The optical assembly comprises an MT ferrule at an interface side, and a light-transmitting ribbon fiber optic cable and a light-receiving ribbon fiber optic cable connected to the MT ferrule at the interface side. The light-transmitting ribbon fiber optic cable is coupled to and aligned with the vertical-cavity surface-emitting laser chip array. The light-receiving ribbon fiber optic cable is coupled to and aligned with the photodetector chip array. The electrical interface comprises gold fingers on the side of the circuit board. The gold fingers and the signal rate converter chip are electrically connected via second microstrip lines. The present invention achieves high-density optical packaging and optimizes the complexity of optical path coupling at the same time.
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Inventors:
LI NING (CN)
ZHANG JIAN (CN)
YANG XIANWEN (CN)
WU TIANSHU (CN)
LI LINKE (CN)
ZHANG JIAN (CN)
YANG XIANWEN (CN)
WU TIANSHU (CN)
LI LINKE (CN)
Application Number:
PCT/CN2018/091456
Publication Date:
October 03, 2019
Filing Date:
June 15, 2018
Export Citation:
Assignee:
LINKTEL TECH CO LTD (CN)
International Classes:
G02B6/42
Foreign References:
| CN106711763A | 2017-05-24 | |||
| CN102565965A | 2012-07-11 | |||
| CN204302542U | 2015-04-29 | |||
| CN106656343A | 2017-05-10 | |||
| US20170003464A1 | 2017-01-05 |
Attorney, Agent or Firm:
BEIJING HUIZE INTELLECTUAL PROPERTY AGENCY CO., LTD (CN)
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