Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2020/105145
Kind Code:
A1
Abstract:
The optical module disclosed in the present application is provided with: a plate-like metal stem (2) in which a metallic lead pin (3) is inserted in a through-hole (30) so as to be coaxial with the through-hole (30); and one sheet of a dielectric substrate (5) equipped with a high-frequency signal line (60) to be connected to the lead pin (2) and a semiconductor optical integrated element (9) which has a semiconductor laser and an optical modulator integrated therein and which is connected to the high-frequency signal line (60) via a bonding wire (8), wherein one lateral face (5a) of the dielectric substrate (5) extends in a direction perpendicular to the light axis direction (La) of the semiconductor optical integrated element (9), and the lateral face (5a) of the dielectric substrate (5) is disposed in contact with a surface (2a) of the metal stem (2).
Inventors:
OTANI TATSUKI (JP)
OKADA NORIO (JP)
OKADA NORIO (JP)
Application Number:
PCT/JP2018/043002
Publication Date:
May 28, 2020
Filing Date:
November 21, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01S5/0239
Domestic Patent References:
| WO2010140473A1 | 2010-12-09 |
Foreign References:
| JP2016225457A | 2016-12-28 | |||
| JP2011197360A | 2011-10-06 | |||
| JP2007059692A | 2007-03-08 | |||
| JP2010135687A | 2010-06-17 | |||
| US20050105911A1 | 2005-05-19 |
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
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