Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2020/129771
Kind Code:
A1
Abstract:
The present invention enables the degree of freedom of an arrangement position of an electrode pad to be increased and routed electrode wiring to be decreased, and enables the degree of integration of a chip to be increased and a large-scale device (optical switch, etc.) to be realized. This optical module comprises a chip which includes a device that is fixed on a fixation metal board and that is constituted by using a planar lightwave circuit (PLC). An interposer (electrical connection interposition part in which electrode pins are attached in an array to the top and bottom surfaces of the interposition part) is disposed layered on the chip. A control board for driving the device is disposed layered on the interposer. The foregoing are mechanically fixed using a fixation screw, etc., and electrical pads of the chip and the control board are connected via the interposer.
Inventors:
YANAGIHARA AI (JP)
SUZUKI KENYA (JP)
GO TAKASHI (JP)
YAMAGUCHI KEITA (JP)
KAWAJIRI YUKO (JP)
SUZUKI KENYA (JP)
GO TAKASHI (JP)
YAMAGUCHI KEITA (JP)
KAWAJIRI YUKO (JP)
Application Number:
PCT/JP2019/048463
Publication Date:
June 25, 2020
Filing Date:
December 11, 2019
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
H01R12/71; G02B6/12; G02F1/313
Domestic Patent References:
| WO2010050087A1 | 2010-05-06 |
Foreign References:
| US20160299361A1 | 2016-10-13 | |||
| JP2016148753A | 2016-08-18 | |||
| JP2010540941A | 2010-12-24 | |||
| JP2017187521A | 2017-10-12 |
Other References:
APOSTOLOPOULOS DIMITRIOS; BAKOPOULOS PARASKEVAS; KALAVROUZIOTIS DIMITRIOS; GIANNOULIS GIANNIS; KANAKIS GIANNIS; ILIADIS NIKOS; SPA: "Photonic intergration enabling new multiplexing concepts in optical board-to-board and rack-to-rack interconnects", PROCEEDINGS OF SPIE, vol. 8991, 8 March 2014 (2014-03-08), pages 1 - 15, XP060036023, DOI: 10.1117/12.2042586
YAN YANG ; MINGBIN YU ; QING FANG ; JUNFENG SONG ; XIAOGUANG TU ; PATRICK GUO-QIANG LO ; RUSLI: "3D silicon photonics packaging based on TSV interposer for high density on-board optics module", IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 3 June 2016 (2016-06-03), Las Vegas, NV, USA, pages 483 - 489, XP032947588, DOI: 10.1109/ECTC.2016.89
YAN YANG ; MINGBIN YU ; QING FANG ; JUNFENG SONG ; XIAOGUANG TU ; PATRICK GUO-QIANG LO ; RUSLI: "3D silicon photonics packaging based on TSV interposer for high density on-board optics module", IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 3 June 2016 (2016-06-03), Las Vegas, NV, USA, pages 483 - 489, XP032947588, DOI: 10.1109/ECTC.2016.89
Attorney, Agent or Firm:
TANI & ABE, P.C. (JP)
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