Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2022/083041
Kind Code:
A1
Abstract:
An optical module, comprising: a circuit board (300); a first lens assembly (400) covering a light-emitting chip array (440), the surface of the first lens assembly having a first reflecting face (410) and a second reflecting face (420); the light-emitting chip array (440), which is arranged on the surface of the circuit board (300) and comprises a plurality of light-emitting chips for emitting multiple beams of signal light of different wavelengths; a first collimating lens array (450), which is arranged between the light-emitting chip array (440) and an optical multiplexing assembly (460) and comprises a plurality of collimating lenses for receiving the signal light from the light-emitting chips and converging same into parallel light; and the optical multiplexing assembly (460), which is arranged on the inner wall of the first lens assembly (400) and used to receive the signal light from the first collimating lens array (450), the signal light from the collimating lenses being incident on different positions of the optical multiplexing assembly (460), and combine the multiple beams of signal light of different wavelengths into one beam of signal light together with the first reflecting face (410), the combined signal light being transmitted to the second reflecting face (420), reflected by the second reflecting surface (420) and then emitted to an external optical fiber. Another optical module correspondingly comprises an optical demultiplexing assembly (560) and a light-receiving chip array (540). The above optical modules achieve the simultaneous transmission of signal light of multiple wavelengths in a single optical fiber, thereby increasing the transmission rate.
Inventors:
LIU XUXIA (CN)
YANG SIGENG (CN)
HE PENG (CN)
MA XIAOLEI (CN)
YANG SIGENG (CN)
HE PENG (CN)
MA XIAOLEI (CN)
Application Number:
PCT/CN2021/077503
Publication Date:
April 28, 2022
Filing Date:
February 23, 2021
Export Citation:
Assignee:
HISENSE BROADBAND MULTIMEDIA TECHNOLOGY CO LTD (CN)
International Classes:
G02B6/42; H04J14/02; H04B10/60
Foreign References:
| US6198864B1 | 2001-03-06 | |||
| CN105556358A | 2016-05-04 | |||
| CN106154444A | 2016-11-23 | |||
| CN1359475A | 2002-07-17 | |||
| CN202872792U | 2013-04-10 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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