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Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2022/183799
Kind Code:
A1
Abstract:
The present invention provides an optical module, comprising a lower housing, an upper housing, a light emitting sub-module, and a circuit board. The light emitting sub-module is disposed in an accommodating cavity defined by the upper housing and the lower housing, and comprises a laser chip used for generating a light beam to achieve light emission; a gold finger and a laser driving chip are provided on the circuit board; the laser driving chip is connected to the gold finger by means of a high-speed signal line; the gold finger is adapted to be electrically connected to an external electrical connector; the laser driving chip is in signal connection with the laser chip; the width dimension of a joint between the gold finger and the high-speed signal line is smaller than the width dimension of a joint between the gold finger and the outside. According to the present invention, the width of the gold finger is locally narrowed, so that the width of the joint between the gold finger and the high-speed signal line is narrowed, the difference between the line width of the gold finger and the line width of the high-speed signal line is reduced, the characteristic impedance at the joint between the gold finger and the high-speed signal line is reduced, impedance discontinuity points of the gold finger are optimized, and the high-frequency performance of the circuit board is improved.

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Inventors:
SHAO YUCHEN (CN)
WANG XINNAN (CN)
ZHANG JIAAO (CN)
YU LIN (CN)
Application Number:
PCT/CN2021/135494
Publication Date:
September 09, 2022
Filing Date:
December 03, 2021
Export Citation:
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Assignee:
HISENSE BROADBAND MULTIMEDIA TECHNOLOGY CO LTD (CN)
International Classes:
H04B10/50
Foreign References:
CN112838896A2021-05-25
CN214177318U2021-09-10
CN109511220A2019-03-22
US20080102653A12008-05-01
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
Download PDF:
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