Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2023/077600
Kind Code:
A1
Abstract:
An optical module (200, 300, 400), comprising a housing (210, 310, 410), a circuit board assembly (220, 320, 420), a photoelectric chip (230, 330, 430), an optical processing assembly (240, 340, 440), and an optical socket (260, 360). The housing (210, 310, 410) comprises a first housing (211, 311, 411) and a second housing (212, 312, 413); the circuit board assembly (220, 320, 420) comprises a hard circuit board (221, 321, 421); the circuit board assembly (220, 320, 420), the photoelectric chip (230, 330, 430), the optical processing assembly (240, 340, 440), and the optical socket (260, 360) are respectively fixed on the first housing (211, 311, 411); the first housing (211, 311, 411) comprises a bottom plate (213, 313); the photoelectric chip (230, 330, 430) is provided on the bottom plate (213, 313); the optical socket (260, 360) is fixed at a position in the first housing (211, 311, 411) corresponding to an optical interface (200b, 300b, 400b); and the optical processing assembly (240, 340, 440) is provided at a position on the bottom plate (213, 313) close to the optical socket (260, 360). The housing (210, 310, 410) of the optical module (200, 300, 400) directly serves as a bearer to bear an optical element and a main power consumption chip assembly, such that a heat sink (433) for bearing the photoelectric chip (230, 330, 430) and a carrier plate for bearing the optical element are omitted, the number of structural parts in the optical module (200, 300, 400) is decreased, the cost is reduced, the occupancy of an ineffective space is narrowed, the utilization rate of an effective space in the optical module (200, 300, 400) is improved, and the optical module has a higher integration level. The main power consumption chip assembly directly dissipates heat to the housing (210, 310, 410) without passing through the heat sink (433), such that the optical module has better heat dissipation performance.
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Inventors:
CHEN LONG (CN)
ZHAI XIONGFEI (CN)
SUN YUZHOU (CN)
WANG DONGHAN (CN)
YU DENGQUN (CN)
LI ANLI (CN)
QIAN CHUNFENG (CN)
ZHAI XIONGFEI (CN)
SUN YUZHOU (CN)
WANG DONGHAN (CN)
YU DENGQUN (CN)
LI ANLI (CN)
QIAN CHUNFENG (CN)
Application Number:
PCT/CN2021/135613
Publication Date:
May 11, 2023
Filing Date:
December 06, 2021
Export Citation:
Assignee:
INNOLIGHT TECH SUZHOU LTD (CN)
International Classes:
H04B10/40; G02B6/42
Foreign References:
| CN109683251A | 2019-04-26 | |||
| CN110658599A | 2020-01-07 | |||
| CN112838897A | 2021-05-25 | |||
| CN109613661A | 2019-04-12 | |||
| US20120266434A1 | 2012-10-25 | |||
| US20040042740A1 | 2004-03-04 |
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