Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2023/246019
Kind Code:
A1
Abstract:
An optical module (200), comprising a first substrate (4025). A first notch area (40253), a second notch area (40254), a first signal transmission area (40251), and a second signal transmission area (40252) are provided on the first substrate (4025); the first and second notch areas (40253, 40254) each are formed by recessing a first side surface and a bottom surface of the first substrate (4025) inwards; a first pin (40231) is provided in the first notch area (40253); a second pin (40232) is provided in the second notch area (40254); the first signal transmission area (40251) and the second signal transmission area (40252) both extend downwards from the first side surface of the first substrate (4025) to top surfaces of the corresponding notch areas; the surfaces of the first and second signal transmission areas (40251, 40252) are respectively provided with first and second signal line transmission layers; the first pin (40231) is connected to the first signal line transmission layer; the second pin (40232) is connected to the second signal line transmission layer; and a laser chip (4026) is provided on a surface of the second signal line transmission layer.
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Inventors:
ZHANG XIAOLEI (CN)
Application Number:
PCT/CN2022/139701
Publication Date:
December 28, 2023
Filing Date:
December 16, 2022
Export Citation:
Assignee:
HISENSE BROADBAND MULTIMEDIA TECHNOLOGY CO LTD (CN)
International Classes:
G02B6/42
Foreign References:
| CN107508141A | 2017-12-22 | |||
| CN108333693A | 2018-07-27 | |||
| CN107452815A | 2017-12-08 | |||
| CN110867722A | 2020-03-06 | |||
| CN216351386U | 2022-04-19 | |||
| US20170035506A1 | 2017-02-09 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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