Title:
OPTICAL PACKAGE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2011/136446
Kind Code:
A1
Abstract:
The present invention relates to an optical package and a method of manufacturing the same, which are capable of reducing the entire volume and thickness of the package by forming a package according to the existing lead frame method through a package using a tape substrate and of producing packages with a high degree of integration by forming a package of a surface emitting method in a dot-emitting method. Further, in accordance with the present invention, luminance and photoefficiency can be increased through a light reflective layer and a white reflective layer or a metal reflective layer and a plating layer.
Inventors:
PAIK JEE HEUM (KR)
Application Number:
PCT/KR2010/006895
Publication Date:
November 03, 2011
Filing Date:
October 08, 2010
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
PAIK JEE HEUM (KR)
PAIK JEE HEUM (KR)
International Classes:
H01L33/48
Domestic Patent References:
| WO2009132618A1 | 2009-11-05 |
Foreign References:
| KR100853963B1 | 2008-08-25 | |||
| US20090206358A1 | 2009-08-20 | |||
| US20080224161A1 | 2008-09-18 | |||
| US20090146155A1 | 2009-06-11 |
Attorney, Agent or Firm:
KIM, Inhan et al. (#80 Soosong-Dong, Chongro-Ku, Seoul 110-733, KR)
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