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Title:
OPTICAL PACKAGE
Document Type and Number:
WIPO Patent Application WO/2020/022278
Kind Code:
A1
Abstract:
An optical package comprising: a circuit substrate having a recess in an upper surface thereof and provided with an optical element in the recess; a substrate of an inorganic material disposed on the circuit substrate so as to cover an opening of the recess; and a metal layer bonding the substrate of an inorganic material and the circuit substrate together. The optical package satisfies the relationship L1 < L2 < L3 < L4, where, in a cross section which is parallel to a stacking direction of the circuit substrate and the substrate of an inorganic material and that passes through the recess, L1 is the distance between an outer-peripheral side end of the circuit substrate and an end of a portion in which the metal layer and the circuit substrate are in contact with each other that is positioned on the outer peripheral side of the circuit substrate, L2 is the distance between the outer-peripheral side end of the circuit substrate and an end of the portion in which the metal layer and the substrate of an inorganic material are in contact with each other that is positioned on the outer peripheral side of the circuit substrate, L3 is the distance between the outer-peripheral side end of the circuit substrate and an end of the portion in which the metal layer and the substrate of an inorganic material are in contact with each other that is positioned on the recess side, and L4 is the distance between the outer-peripheral side end of the circuit substrate and an end of the portion in which the metal layer and the circuit substrate are in contact with each other that is positioned on the recess side.

Inventors:
TAKIKAWA, Jumpei (5-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
KIKUGAWA, Shinya (5-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
HIRAMOTO, Makoto (5-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
ENOMOTO, Kotaro (5-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
Application Number:
JP2019/028692
Publication Date:
January 30, 2020
Filing Date:
July 22, 2019
Export Citation:
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Assignee:
AGC INC. (5-1 Marunouchi 1-chome, Chiyoda-ku Tokyo, 05, 〒1008405, JP)
International Classes:
H01L33/48; H01L23/02
Domestic Patent References:
WO2018043094A12018-03-08
Foreign References:
JP2015018873A2015-01-29
US20160126426A12016-05-05
US20150014711A12015-01-15
JP2000286352A2000-10-13
JPH08250615A1996-09-27
JPS6010757A1985-01-19
Attorney, Agent or Firm:
ITOH, Tadashige et al. (16th Floor, Marunouchi MY PLAZA 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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