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Title:
OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/043096
Kind Code:
A1
Abstract:
A light-emitting device 10 that comprises: a package substrate 30 that has a recess 34 that opens in an upper surface 31; a light-emitting element 20 that is housed in the recess 34; a window member 40 that is arranged to cover the opening of the recess 34; and a metal joining part 53 that seals the space between the package substrate 30 and the window member 40. The package substrate 30 has: a mounting surface 61 that has provided thereon a metal electrode on which the light-emitting element 20 is mounted; a frame-shaped separation surface 62 that is provided outside the mounting surface 61; and a light-reflecting surface 63 that slopes from the separation surface 62 toward the upper surface 31. A metal layer that avoids the separation surface 62 is provided upon the light-reflecting surface.

Inventors:
ICHINOKURA HIROYASU (JP)
NIIZEKI SHOICHI (JP)
Application Number:
PCT/JP2017/029117
Publication Date:
March 08, 2018
Filing Date:
August 10, 2017
Export Citation:
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Assignee:
NIKKISO CO LTD (JP)
International Classes:
H01L33/52; H01L23/02
Domestic Patent References:
WO2011118639A12011-09-29
Foreign References:
JP2015018873A2015-01-29
JP2004179438A2004-06-24
JP2007266357A2007-10-11
JP2003273405A2003-09-26
JP2003347597A2003-12-05
US20150014711A12015-01-15
Attorney, Agent or Firm:
MORISHITA Sakaki (JP)
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