OPTICAL-SEMICONDUCTOR-ELEMENT SEALING COMPOSITION, OPTICAL-SEMICONDUCTOR-ELEMENT SEALING MOLDED ARTICLE, OPTICAL-SEMICONDUCTOR-ELEMENT SEALING SHEET, OPTICAL SEMICONDUCTOR DEVICE, AND SEALED OPTICAL SEMICONDUCTOR ELEMENT

WIPO Patent Application WO/2015/033890

A1

This optical-semiconductor-element sealing composition contains a sealing resin and optically diffusive organic particles. The absolute value of the difference between the index of refraction of the sealing resin and the index of refraction of the optically diffusive organic particles is 0.020-0.135, inclusive. The proportion of optically diffusive organic particles contained in the optical-semiconductor-element sealing composition in relation thereto is 1-10 mass%, inclusive. The optical-semiconductor-element sealing composition may be used in an optical semiconductor element.

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CHANG CHENG (JP)
MITANI MUNEHISA (JP)
KATAYAMA HIROYUKI (JP)
EBE YUKI (JP)
FUJII HIRONAKA (JP)
YAMADA MASAJI (JP)

PCT/JP2014/072939

March 12, 2015

September 01, 2014

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NITTO DENKO CORP (JP)

H01L33/52; C09K11/08; F21V9/08; F21V9/16; H01L33/50; H01L33/60; F21Y101/02

WO2013018494A1

2013-02-07

JP2009084511A	2009-04-23
JP2009054995A	2009-03-12
JP2012015175A	2012-01-19
JP2009239022A	2009-10-15
JP2006294343A	2006-10-26

OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)

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