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Title:
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2012/169147
Kind Code:
A1
Abstract:
An optical semiconductor package, a method for manufacturing the optical semiconductor package, and an optical semiconductor device of the present invention are capable of suppressing deterioration of a resin and capable of suppressing deterioration of reflectance using a thermosetting resin, such as an unsaturated polyester, as a material of a reflector (5) or as a resin (6) that is exposed at the periphery of the optical semiconductor element.

Inventors:
FUKUSHIMA SUMITAKA
SAKAMOTO HIROYUKI
TAKAGI HAYATO
Application Number:
PCT/JP2012/003521
Publication Date:
December 13, 2012
Filing Date:
May 30, 2012
Export Citation:
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Assignee:
PANASONIC CORP (JP)
FUKUSHIMA SUMITAKA
SAKAMOTO HIROYUKI
TAKAGI HAYATO
International Classes:
H01L33/48
Domestic Patent References:
WO2010082660A12010-07-22
Foreign References:
JP2011103437A2011-05-26
JP2007138017A2007-06-07
JPS5868992A1983-04-25
JPH1095910A1998-04-14
JP2002249636A2002-09-06
JP2006156704A2006-06-15
JP2004251950A2004-09-09
JP2006157034A2006-06-15
Attorney, Agent or Firm:
MORIMOTO INT'L PATENT OFFICE (JP)
Patent business corporation Morimoto international patent firm (JP)
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