Title:
OPTICAL SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2024/058038
Kind Code:
A1
Abstract:
This optical sensor module (101) is provided with: a first substrate (51) which has a first surface (51a) that comprises a first region and a second region; a light emitting element (2) which is mounted on the first region; a light receiving element (3) which is mounted on the second region; a first annular member (41) which is connected to the first surface (51a) so as to surround the light emitting element (2); a second annular member (42) which is connected to the first surface (51a) so as to surround the light receiving element (3); and a second substrate (52) which is arranged so as to partially overlap with the first substrate (51), while being parallel to the first substrate (51). The second substrate (52) has a first opening (521) in a region that includes the projection region of the light emitting element (2), while having a second opening (522) in a region that includes the projection region of the light receiving element (3). The first annular member (41) is arranged so as to surround the first opening (511), while being connected to the second substrate (52). The second annular member (42) is arranged so as to surround the second opening (522), while being connected to the second substrate (52). A first transparent substrate (71) is fitted to the second substrate (52) so as to close the first opening (521). A second transparent substrate (72) is fitted to the second substrate (52) so as to close the second opening (522). A sealing resin (6) is arranged so as to seal a region of the first substrate (51)-side surface of the second substrate (52), the region being on the outer side of the first annular member (41), while being on the outer side of the second annular member (42).
Inventors:
BANBA SHINICHIRO (JP)
Application Number:
PCT/JP2023/032634
Publication Date:
March 21, 2024
Filing Date:
September 07, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L31/12
Domestic Patent References:
| WO2019163198A1 | 2019-08-29 | |||
| WO2018012621A1 | 2018-01-18 |
Foreign References:
| JP2019096778A | 2019-06-20 | |||
| JP2019111067A | 2019-07-11 | |||
| US20190273175A1 | 2019-09-05 | |||
| US20120248625A1 | 2012-10-04 | |||
| CN105206627A | 2015-12-30 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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