OPTICAL SUBSTRATE, SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND MANUFACTURING METHOD FOR SAME

WIPO Patent Application WO/2014/057808

A1

An optical substrate PP (10) includes a substrate body and a recess/bump structure (20) formed of a plurality of bumps (20a) provided on the main surface of the substrate body. Markings (X) that can be observed with an optical microscope are formed on the main surface. The interval between the markings is larger than the pitch of the recess/bump structure (20). The markings (X) can be recognized as first areas (Xa) and a second area (Xb) by a difference in brightness in an optical microscopic image of the markings (X). A plurality of first areas (Xa) are arranged at intervals, and the second area (Xb) exists among the first areas (Xa). According to the present invention, the improvement of the internal quantum efficiency (IQE) and the improvement of the light extraction efficiency (LEE) of semiconductor light-emitting elements, which have been said to be a trade-off, are achieved at the same time.

KOIKE JUN (JP)
YAMAGUCHI FUJITO (JP)
INOUE NAOKI (JP)
MUROO HIROYUKI (JP)

PCT/JP2013/075943

April 17, 2014

September 25, 2013

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ASAHI KASEI E MATERIALS CORP (JP)

H01L33/22

JP2007088277A	2007-04-05
JP2012033521A	2012-02-16
JP2012059750A	2012-03-22
JP2011192880A	2011-09-29
JP2003318441A	2003-11-07
JP2007294972A	2007-11-08
JP2005259970A	2005-09-22

IEEE PHOTO. TECH. LETT., vol. 20, 2008, pages 13
J. APPL. PHYS., vol. 103, 2008, pages 014314
See also references of EP 2908353A4

AOKI, HIROYOSHI (JP)
Hiroyoshi Aoki (JP)

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