OPTICAL TRANSMISSION MODULE AND OPTICAL COMMUNICATION DEVICE USING SAME

WIPO Patent Application WO/2011/129183

A1

The disclosed optical transmission module is provided with an optical element (20) which has: a principal surface (first principal surface, 20a) which serves as a light emission/reception surface; and a principal surface (second principal surface, 20b) on the opposite side from the first principal surface (20a). The optical element (20) is mounted to a wiring substrate using a flip chip connection method via a plurality of bump electrodes formed on the second principal surface (20b). A lens (optical lens, 12) is affixed to the first principal surface (20a) side of the optical element (20). A heat-dissipation block (heat-dissipation member, 16) is affixed between the optical element (20) and the lens (12). The bottom surface (first surface, 16a) of the heat-dissipation member abuts against the first principal surface (20a) of the optical element (20). This improves the heat-dissipation performance of the optical transmission module.

YUUKI FUMIO (JP)
YAMASHITA HIROKI (JP)
TSUJI SHINJI (JP)
SHINODA KAZUNORI (JP)

PCT/JP2011/057004

October 20, 2011

March 23, 2011

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HITACHI LTD (JP)
YUUKI FUMIO (JP)
YAMASHITA HIROKI (JP)
TSUJI SHINJI (JP)
SHINODA KAZUNORI (JP)

H01S5/022; G02B6/42

JP2010067731A	2010-03-25
JP2007249194A	2007-09-27
JP2008041770A	2008-02-21
JP2006202998A	2006-08-03
EP0536945A1	1993-04-14
JPH04241477A	1992-08-28
JPH03273205A	1991-12-04

TSUTSUI, YAMATO (JP)
Tsutsui Daiwa (JP)

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