Title:
ORGANIC ADDITIVE FOR ELECTROLYTIC COPPER PLATING COMPRISING TWO TYPES OF LEVELERS, AND ELECTROLYTIC COPPER PLATING SOLUTION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2017/052002
Kind Code:
A1
Abstract:
An organic additive for electrolytic copper plating, according to one aspect of the present invention, is added to a copper plating solution for forming a copper film on a substrate having a pattern formed thereon by an electrolytic plating method, and comprises at least two types of levelers in order to increase the uniformity and flatness of the copper film formed on the pattern.
Inventors:
LEE MIN HYUNG (KR)
LEE WOON YOUNG (KR)
LEE WOON YOUNG (KR)
Application Number:
PCT/KR2016/000990
Publication Date:
March 30, 2017
Filing Date:
January 29, 2016
Export Citation:
Assignee:
KOREA IND TECH INST (KR)
International Classes:
C25D3/38; C07C211/62; C07C211/63; C25D9/02
Foreign References:
| JP5518925B2 | 2014-06-11 | |||
| JP2009541580A | 2009-11-26 | |||
| JP2001107289A | 2001-04-17 | |||
| KR101165222B1 | 2012-07-17 | |||
| JP4538049B2 | 2010-09-08 |
Attorney, Agent or Firm:
KIM, Nam Sik et al. (KR)
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