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Patent Searching and Data


Title:
ORGANIC DAMPING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2008/075604
Kind Code:
A1
Abstract:
An organic damping material which by itself has excellent damping properties without being combined with other material(s), need not have a certain thickness or volume for ensuring sufficient damping performance, and is easy to process. It is characterized by comprising a polymer matrix phase and a phase dispersed therein comprising one or more compounds selected among p-(p-toluenesulfonylamido)diphenylamine, 4,4'-bis(α,α-dimethylbenzyl)diphenylamine, octylated diphenylamine, 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), 4,4'-thiobis(3-methyl-6-tert-butylphenol), and N,N'-di-2-naphthyl-p-phenylenediamine.

Inventors:
HORI MITSUO (JP)
SAITOU AKIRA (JP)
HORI TAKASHI (JP)
Application Number:
PCT/JP2007/073990
Publication Date:
June 26, 2008
Filing Date:
December 13, 2007
Export Citation:
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Assignee:
R & D LLC AS (JP)
HORI MITSUO (JP)
SAITOU AKIRA (JP)
HORI TAKASHI (JP)
International Classes:
C09K3/00; C08K5/17; C08L101/00; C09D5/03; C09D7/12; C09D201/00; C09J11/06; C09J201/00; F16F15/02
Foreign References:
JP2000281838A2000-10-10
JP2000273435A2000-10-03
JP2002069424A2002-03-08
JP2002012848A2002-01-15
JP2002173663A2002-06-21
JP2004080003A2004-03-11
JP2006124618A2006-05-18
JP2006257235A2006-09-28
JP2003003125A2003-01-08
JP2005126644A2005-05-19
Attorney, Agent or Firm:
NISHIO, Akira (MonjyuMotosu-shi, Gifu 03, JP)
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