Title:
ORGANIC FIBER BASE MATERIAL WITH RESIN ADHERED THERETO
Document Type and Number:
WIPO Patent Application WO/2024/084927
Kind Code:
A1
Abstract:
This organic fiber base material with a resin adhered thereto comprises an organic fiber base material and dot-shaped resin parts provided on at least one face of the organic fiber base material. The organic fiber base material has a melting point M of 200-500°C. The ratio A of the mass per unit area of the resin parts to the mass per unit area of the organic fiber base material is 0.30-6.00%. The average diameter D of the resin parts is 0.1-3.0 mm. The ratio R of the average center-to-center distance of the resin parts to the average diameter D of the resin parts is 1.00-5.00. The melting point M, the ratio A, the average diameter D, and the ratio R satisfy formula (1). Formula (1): 1.05≤100×A1/2/(M1/2×D1/2×R2)≤2.62
Inventors:
FUJINO NOBU (JP)
Application Number:
PCT/JP2023/035703
Publication Date:
April 25, 2024
Filing Date:
September 29, 2023
Export Citation:
Assignee:
NITTO BOSEKI CO LTD (JP)
International Classes:
D06M23/16; B32B3/14; B32B27/12; B32B27/18; D06M101/32; D06M101/36
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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