ORGANIC FILM CMP SLURRY COMPOSITION AND POLISHING METHOD USING SAME

Title:

ORGANIC FILM CMP SLURRY COMPOSITION AND POLISHING METHOD USING SAME

Document Type and Number:

WIPO Patent Application WO/2019/093620

Kind Code:

A1

Abstract:

Provided are an organic film CMP slurry composition comprising ceria, a cerium-containing ceria activating agent, and an inorganic film surface protecting agent, and an organic film polishing method using the same.

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Inventors:

CHOI JUNG MIN (KR)
JUNG YOUNG CHUL (KR)
KIM JEONG HEE (KR)
KANG DONG HUN (KR)

Application Number:

PCT/KR2018/008229

Publication Date:

May 16, 2019

Filing Date:

July 20, 2018

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Assignee:

SAMSUNG SDI CO LTD (KR)

International Classes:

C09G1/02; C09K3/14; H01L21/306

Foreign References:

KR20170040452A	2017-04-13
KR20150010570A	2015-01-28
KR20170076251A	2017-07-04
KR101178236B1	2012-08-29
KR20070057009A	2007-06-04

Attorney, Agent or Firm:

AJU INTERNATIONAL LAW & PATENT GROUP (KR)

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