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Title:
ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2008/114705
Kind Code:
A1
Abstract:
Disclosed is a useful organic insulating material having low dielectric constant, high heat resistance and high mechanical strength. Also disclosed are a resin film using the organic insulating material and a semiconductor device. The organic insulating material contains a prepolymer composed of an adamantane structure compound having a group containing a polymerizable unsaturated bond. The prepolymer has a number average molecular weight of not less than 2,000 but not more than 500,000 in terms of polystyrene as determined by gel permeation chromatography. The group containing a polymerizable unsaturated bond is preferably a group containing a carbon-carbon triple bond. The resin film is obtained by a crosslinking reaction and a condensation reaction of the organic insulating material or a varnish for resin films containing the organic insulating material, which reactions are caused by heating and/or irradiation of an active radiation ray.

Inventors:
SANO, Yohko (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 1400002, JP)
佐野曜子 (〒02 東京都品川区東品川二丁目5番8号住友ベークライト株式会社内 Tokyo, 1400002, JP)
MATSUTANI, Mihoko (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 1400002, JP)
Application Number:
JP2008/054690
Publication Date:
September 25, 2008
Filing Date:
March 07, 2008
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO., LTD. (5-8 Higashi-Shinagawa 2-chome, Shinagawa-ku Tokyo, 02, 1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川二丁目5番8号 Tokyo, 1400002, JP)
SANO, Yohko (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 1400002, JP)
佐野曜子 (〒02 東京都品川区東品川二丁目5番8号住友ベークライト株式会社内 Tokyo, 1400002, JP)
International Classes:
C08F38/00; C08F299/00; C09D4/00; C09D5/00; C09D5/25; H01B3/44; H01L21/312
Foreign References:
US20040204008A12004-10-14
JP2005343985A2005-12-15
JP2006241239A2006-09-14
JP2006257212A2006-09-28
JP2006249255A2006-09-21
JP2007031480A2007-02-08
JP2005522528A2005-07-28
JP2001332543A2001-11-30
JP2005041938A2005-02-17
Other References:
See also references of EP 2157107A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg.5-1, Toranomon 3-chom, Minato-ku Tokyo 23, 1058423, JP)
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