Title:
ORGANIC LIGHT EMITTING DIODE PACKAGING STRUCTURE AND METHOD, AND ORGANIC LIGHT EMITTING DIODE
Document Type and Number:
WIPO Patent Application WO/2017/096696
Kind Code:
A1
Abstract:
An organic light emitting diode packaging method, an organic light emitting diode packaging structure (20), and an organic light emitting diode (100) having the organic light emitting diode packaging structure (20). The organic light emitting diode packaging structure (20) comprises: a first packaging film layer (21), a second packaging film layer (22) on the surface of a side of the first package film layer (21), and scattering particles (23) formed between the first packaging film layer (21) and the second packaging film layer (22) and used for forming scattered incident light. For the organic light emitting diode packaging method, the organic light emitting diode packaging structure (20), and the organic light emitting diode (100), the scattering particles (23) are formed in a cathode packaging film layer and able to implement a scattering function on ambient light and stray light, so as to reduce reflection of light caused by a cathode (10), so that the clarity and contrast ratio of the organic light emitting diode (100) can be improved.
Inventors:
CHEN LIXUAN (CN)
Application Number:
PCT/CN2016/071543
Publication Date:
June 15, 2017
Filing Date:
January 21, 2016
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
H01L51/52; H01L51/50; H01L51/56
Foreign References:
| CN103650196A | 2014-03-19 | |||
| US7952105B2 | 2011-05-31 | |||
| US20120155093A1 | 2012-06-21 | |||
| CN104040750A | 2014-09-10 |
Attorney, Agent or Firm:
MING & YUE INTELLECTUAL PROPERTY LAW FIRM (CN)
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