ORGANIC POLYMER, SEMICONDUCTOR HARD MASK COMPOSITION COMPRISING SAME, AND PATTERNING METHOD USING SAME

Title:

ORGANIC POLYMER, SEMICONDUCTOR HARD MASK COMPOSITION COMPRISING SAME, AND PATTERNING METHOD USING SAME

Document Type and Number:

WIPO Patent Application WO/2023/214800

Kind Code:

A1

Abstract:

The present invention relates to an organic polymer having improved etching resistance, solubility, and mechanical properties by comprising a polymer of a specific component, a semiconductor hard mask composition comprising same, and a patterning method using same. The present invention provides a polymer for a semiconductor hard mask comprising a structure represented by chemical formula 1 below. [Chemical Formula 1] (R1 is a hydrocarbon containing one or more benzene ring structures, and n is an integer from 1 to 10000.)

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Inventors:

CHA HYUK JIN (KR)
LEE KEUN JOO (KR)
KIM DEOGBAE (KR)
KIM KEUN SOO (KR)

Application Number:

PCT/KR2023/006050

Publication Date:

November 09, 2023

Filing Date:

May 03, 2023

Export Citation:

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Assignee:

HUNET PLUS CO LTD (KR)

International Classes:

C08G61/02; C08K5/3445; C08L61/24; C08L61/28; C08L65/00; H01L21/033

Domestic Patent References:

WO2008120855A1

2008-10-09

Foreign References:

KR101484568B1	2015-01-21
KR102336257B1	2021-12-06
KR102191919B1	2020-12-16
KR102194297B1	2020-12-22

Attorney, Agent or Firm:

KWAK, Hyun Kyu (KR)

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