Title:
ORGANIC RESIN COMPOSITION SHEET FOR COVERING ELECTRONIC COMPONENT AND METHOD FOR PROCESSING ELECTRONIC COMPONENT USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/168723
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an organic resin composition sheet for covering an electronic component that improves yield from a processing step and has superior reliability. The organic resin composition sheet for covering an electronic component comprises a layer (hereinafter called "layer 1") containing a binder polymer, a photopolymerizable compound with at least two photopolymerizable groups, and a photopolymerization initiator, and is characterized in that the storage elastic modulus at 80°C of the layer 1 is 0.05-10 MPa, and the storage elastic modulus at 80°C of the layer 1 after photocuring by irradiating the layer 1 with light of 5000 mJ, is 10 MPa-10 GPa.
Inventors:
SHIMIZU HIROO (JP)
KANAMORI DAISUKE (JP)
MURAKAMI YUTA (JP)
MATSUMOTO AKIKO (JP)
KOBAYASHI YUTA (JP)
KANAMORI DAISUKE (JP)
MURAKAMI YUTA (JP)
MATSUMOTO AKIKO (JP)
KOBAYASHI YUTA (JP)
Application Number:
PCT/JP2022/003037
Publication Date:
August 11, 2022
Filing Date:
January 27, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B32B27/16; B32B7/022; C09D201/00; C09J7/30; C09J7/35; C09J11/00; C09J133/00; C09J163/00; C09J201/00; G03F7/004; G03F7/027; G03F7/38; H01L23/29; H01L23/31; H05K3/28
Foreign References:
| JP2014192446A | 2014-10-06 | |||
| JP2010200221A | 2010-09-09 | |||
| JP2018173469A | 2018-11-08 |
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