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Patent Searching and Data


Title:
ORGANIC RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2021/215382
Kind Code:
A1
Abstract:
An organic resin film according to the present disclosure contains a resin that is mainly composed of a cyclic olefin copolymer, a first solvent, and a second solvent that has a lower boiling point than the first solvent. The first solvent is composed of at least one solvent that is selected from the group consisting of toluene, xylene, naphtha, octane, decalin, glycol ethers, decane and tridecane. The second solvent is composed of at least one solvent that is selected from the group consisting of cyclohexane, benzene, hexane, chloroform and dichloroethane.

Inventors:
KAJITA SATOSHI (JP)
NAGASAWA TADASHI (JP)
CHIKARA CHIE (JP)
YOSHIURA SATOSHI (JP)
FUJIKAWA KOUJI (JP)
Application Number:
PCT/JP2021/015809
Publication Date:
October 28, 2021
Filing Date:
April 19, 2021
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
C08F32/00; C08J5/18; H05K1/03; H05K3/46
Domestic Patent References:
WO2015133473A12015-09-11
Foreign References:
JP2019147930A2019-09-05
JP2015140364A2015-08-03
JP2020004852A2020-01-09
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
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