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Title:
ORGANIC SILICON COMPOUND, THERMOSETTING COMPOSITION CONTAINING SAID ORGANIC SILICON COMPOUND, AND SEALING MATERIAL FOR OPTICAL SEMICONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2010/140635
Kind Code:
A1
Abstract:
Disclosed is a liquid organic silicon compound containing a structural unit represented by formula (1-a) and a structural unit represented by formula (1-b). In formula (1-a), each symbol R1 independently represents a group selected from cyclopentyls, cyclohexyls and C1-4 alkyls; in formula (1-b), R2 and R3 independently represent groups selected from cyclopentyls, cyclohexyls and C1-4 alkyls, and n is an integer between 2 and 50. Here, if α and β are the mole fractions of each of the structural units in the liquid organic silicon compound, then the ratio between α and n x β (α : n x β) is between 1:3 and 1:100.

Inventors:
INOKI DAISUKE
KAWABATA KIICHI
TAJIMA AKIO
MATSUO TAKASHI
Application Number:
PCT/JP2010/059386
Publication Date:
December 09, 2010
Filing Date:
June 02, 2010
Export Citation:
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Assignee:
CHISSO CORP (JP)
INOKI DAISUKE
KAWABATA KIICHI
TAJIMA AKIO
MATSUO TAKASHI
International Classes:
C08G77/50; C08G77/12; C08L83/05; C08L83/07; C08L83/14; C09D183/05; C09D183/07; C09D183/14; C09K3/10; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
WO2004081084A12004-09-23
WO2007119627A12007-10-25
WO2009119253A12009-10-01
WO2009084562A12009-07-09
WO2004081084A12004-09-23
WO2003024870A12003-03-27
WO2004024741A12004-03-25
WO2004024741A12004-03-25
Foreign References:
JP2006022207A2006-01-26
JP2007031619A2007-02-08
JP2005290352A2005-10-20
JP2009298908A2009-12-24
JPS61112334A1986-05-30
JPH02289611A1990-11-29
JP2003277473A2003-10-02
JP2006070049A2006-03-16
JP2004331647A2004-11-25
JP2009133518A2009-06-18
Other References:
See also references of EP 2439225A4
Attorney, Agent or Firm:
OGURI Shohei et al. (JP)
Shohei Oguri (JP)
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