ORGANOPOLYSILOXANE CURED FILM, USE THEREOF, AND METHOD FOR PRODUCING SAME

Title:

ORGANOPOLYSILOXANE CURED FILM, USE THEREOF, AND METHOD FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2020/017480

Kind Code:

A1

Abstract:

[Problem] To provide: an organopolysiloxane cured film which can be thinned, has very few surface and internal defects, and exhibits high dielectric breakdown strength against load voltage; a use thereof; and a method for producing same. [Solution] The present invention provides an organopolysiloxane cured film having an average thickness in the range of 1-200 µm, wherein the number of surface defects in the film as measured using an optical means is in the range of 0-1 for an arbitrary region having a unit area of 15 mm × 15 mm, and preferably, the number of internal defects is in the range of 0-20. This film may be obtained by a rolling process in a clean room or the like, or may be obtained by curing between separators having an appropriate release layer.

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Inventors:

FUKUI HIROSHI (JP)
KAMINAGA YOICHI (JP)
TSUDA TAKEAKI (JP)

Application Number:

PCT/JP2019/027836

Publication Date:

January 23, 2020

Filing Date:

July 16, 2019

Export Citation:

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Assignee:

DOW TORAY CO LTD (JP)

International Classes:

C08J5/18; C08L83/05; C08L83/07

Domestic Patent References:

WO2017183541A1	2017-10-26
WO2017183541A1	2017-10-26
WO2014105959A1	2014-07-03

Foreign References:

JP2012078144A	2012-04-19
JP2003176462A	2003-06-24

Other References: