ORGANOPOLYSILOXANE CURED PRODUCT FILM AND USAGE, MANUFACTURING METHOD, AND MANUFACTURING APPARATUS THEREFOR

WIPO Patent Application WO/2020/166692

A1

The purpose of the present invention is to provide: an organopolysiloxane cured product film that is superior as a thin film and in terms of flatness, that has an extremely superior smoothness and flatness at the film surface, and which can be expected to have a high dielectric breakdown strength against a load voltage; as well as a usage and manufacturing method therefor. Provided is an organopolysiloxane cured product film in which the arithmetic average height (Sa) of the film surface is less than 0.50 μm, and the average thickness at the center of the film is in the range of 1-20 μm. It is possible to obtain such a film by means of a manufacturing method including a die application step in which a slot die is used to apply a curable organopolysiloxane composition on a continuously traveling base material supported between a pair of support rolls by means of a tension support system.

FUKUI HIROSHI (JP)
TSUDA TAKEAKI (JP)

PCT/JP2020/005725

August 20, 2020

February 14, 2020

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DOW TORAY CO LTD (JP)

B05C13/02; B05C5/02; B05D1/26; B05D3/00; B05D7/00; B05D7/24; B29C41/28; B29C41/36; C08J5/18; C08K3/08; C08K5/56; C08L83/05; C08L83/07; H01L23/29; H01L23/31; B29K83/00; B29L7/00

WO2018211981A1	2018-11-22
WO2018056297A1	2018-03-29
WO2014105965A1	2014-07-03
WO2018155131A1	2018-08-30
WO2017183541A1	2017-10-26
WO2014105959A1	2014-07-03

JP2016500382A	2016-01-12
JP2005288377A	2005-10-20
JP2016113506A	2016-06-23
JP2014116587A	2014-06-26
JP2012115788A	2012-06-21
JP2018229642A	2018-12-07
JP2016500382A	2016-01-12

See also references of EP 3964299A4

MURAYAMA Yasuhiko et al. (JP)

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