ORGANOSILICON COMPOUND AND THERMOSETTING HEAT CONDUCTIVE SILICONE COMPOSITION

WIPO Patent Application WO/2019/031082

A1

The present invention is an organosilicon compound which is represented by general formula (1). Consequently, the present invention provides an organosilicon compound that is used in a thermosetting heat conductive silicone composition which is able to be highly filled with a heat conductive filler, and which is able to be suppressed in decrease in the strength even in cases where the thermosetting heat conductive silicone composition is highly filled with a heat conductive filler. (In the formula, R1 represents an alkyl group having 1-6 carbon atoms; R2 independently represents a hydrogen atom or an unsubstituted or substituted monovalent hydrocarbon group; each of R3 and R4 independently represents an unsubstituted or substituted monovalent hydrocarbon group; R5 represents a hydrogen atom or an alkenyl group; m represents an integer of 1-30; and n represents an integer of 3 or 4.)

ISHIHARA YASUHISA (JP)
FUKAMACHI TAKUMI (JP)
OZAI TOSHIYUKI (JP)
ENDO AKIHIRO (JP)

PCT/JP2018/023903

February 14, 2019

June 22, 2018

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SHINETSU CHEMICAL CO (JP)

C07F7/18; C08K5/5415; C08K5/5425; C08L83/05; C08L83/07

JP2008056761A	2008-03-13
JP2007332104A	2007-12-27
JP2008019426A	2008-01-31
JP2011178821A	2011-09-15
JP2017222819A	2017-12-21
JP2005325212A	2005-11-24
JP2014062198A	2014-04-10
JP2012007057A	2012-01-12
JPS64173A	1989-01-05
JP3290127B2	2002-06-10
JP2004262972A	2004-09-24
JP2005162975A	2005-06-23
US3220972A	1965-11-30
US3159601A	1964-12-01
US3159662A	1964-12-01
US3775452A	1973-11-27

See also references of EP 3666781A4

YOSHIMIYA Mikio et al. (JP)

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