Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ORGANOSILICON-MODIFIED POLYIMIDE RESIN COMPOSITION AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/086963
Kind Code:
A3
Abstract:
An organosilicon-modified polyimide composition, comprising an organosilicon-modified polyimide, a thermal curing agent, a fluorescent powder and heat dissipation particles. The composition has excellent heat resistance, mechanical strength and light transmittance. The organosilicon-modified polyimide resin composition forms a filament base material after coating and drying, and an obtained filament has good flexibility, which enables the filament to be formed in a variety of shapes and achieve 360° omnidirectional light illumination.

Inventors:
SAITO, Yukihiro (No. 1288, Jiachuang Rd. Xiuzhou Area,Jiaxin, Zhejiang 3, 321403, CN)
UNAGI IKE, Hayato (No. 1288, Jiachuang Rd. Xiuzhou Area,Jiaxin, Zhejiang 3, 321403, CN)
Application Number:
IB2018/001560
Publication Date:
July 25, 2019
Filing Date:
September 18, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD (No.1288 Jiachuang Rd, Xiuzhou AreaJiaxing, Zhejiang 3, 321403, CN)
International Classes:
C08G73/10; C08J5/18; C09J163/00; H01L25/075
Foreign References:
CN101914357A2010-12-15
CN105542693A2016-05-04
CN104231994A2014-12-24
CN105295792A2016-02-03
CN101360801A2009-02-04
US20050107497A12005-05-19
Attorney, Agent or Firm:
CHINA SINDA INTELLECTUAL PROPERTY LTD. (B11th Floor, Focus Place19 Financial Stree, Xicheng District Beijing 3, 100033, CN)
Download PDF: