Title:
ORGANOSILOXANE, CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/186324
Kind Code:
A1
Abstract:
An organosiloxane represented by a general formula; a curable silicone composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane having, per molecule, at least two hydrogen atoms each having a silicon atom bound thereto, (C) an adhesion promoter comprising the above-mentioned organosiloxane and (D) a hydrosilylation reaction catalyst; and a semiconductor device in which a semiconductor element is sealed with a cured product of the above-mentioned composition. Provided are: a novel organosiloxane; a curable silicone composition which contains the organosiloxane as an adhesion promoter and can be formed into a cured article having excellent adhesion to various base materials; and a semiconductor device which is produced using the composition and has excellent reliability.
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Inventors:
IIMURA TOMOHIRO (JP)
TODA NOHNO (JP)
INAGAKI SAWAKO (JP)
MIYAMOTO YUSUKE (JP)
FURUKAWA HARUHIKO (JP)
TODA NOHNO (JP)
INAGAKI SAWAKO (JP)
MIYAMOTO YUSUKE (JP)
FURUKAWA HARUHIKO (JP)
Application Number:
PCT/JP2015/002718
Publication Date:
December 10, 2015
Filing Date:
May 29, 2015
Export Citation:
Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
C07F7/08; C08G59/10; C08G77/388; C08K5/544; C08L83/05; C08L83/07; C08L83/08; C09J11/06; C09J183/07; H01L23/29; H01L23/31
Foreign References:
| JP2012052029A | 2012-03-15 | |||
| JP2010138380A | 2010-06-24 | |||
| JP2009275206A | 2009-11-26 | |||
| JP2000344895A | 2000-12-12 | |||
| US4374986A | 1983-02-22 |
Other References:
See also references of EP 3153517A4
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