ORGANOSILOXANES AND THEIR USE IN DIELECTRIC FILMS OF SEMICONDUCTORS

WIPO Patent Application WO2003070809

B1

The present invention provides an organosiloxane comprising at least 80 weight percent of Formula (I): (YO-01-1,OSiO1.5-2]a[Z0.01-1.0SiO1.5-2]b[H0.01-1.0SiO1.5-2]c where Y is aryl; Z is alkenyl; a is from 15 percent to 70 percent of Formula (I); b is from 2 percent to 50 percent of Formula (I); and c is from 20 percent to 80 percent of Formula (I). The present organosiloxane may be used as ceramic binder, high temperature encapsulant, and fiber matrix binder. The present composition is also useful as an adhesion promoter in that it exhibits good adhesive properties when coupled with other materials in non-microelectronic or microelectronic applications. Preferably, the present compositions are used in microelectronic applications as etch stops, hardmasks, and dielectrics.

WO/1994/001487	MONODISPERSED POLYDIMETHYLSILOXANE-alpha,omega-DIOL FLUIDS AND alpha,beta-SUBSTITUTED POLYDIMETHYLSILOXANES
WO/2014/021174	LIQUID CRYSTAL ALIGNING AGENT, LIQUID CRYSTAL ALIGNMENT FILM, LIQUID CRYSTAL DISPLAY ELEMENT AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY ELEMENT
WO/2014/143926	ETHYLENICALLY UNSATURATED POLYMERIZABLE GROUPS COMPRISING POLYCARBOSILOXANE MONOMERS

BEDWELL WILLIAM B
MUKHERJEE SHYAMA P
MORO LORENZA
XIE SONGYUAN
NEDBAL JAN
IWAMOTO NANCY
LEUNG ROGER Y
HACKER NIGEL P

PCT/US2003/005171

July 08, 2004

February 19, 2003

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HONEYWELL INT INC (US)

C08G77/20; C08G77/04; C08G77/12; C09D183/04; C09J183/04; G03F7/075; H01L21/312; H01L21/768; H01L23/522; H01L23/532; (IPC1-7): C08G77/20; H01L21/312; G03F7/075

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