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Title:
ORIENTATION-INDEPENDENT THERMOSYPHON HEAT SPREADER
Document Type and Number:
WIPO Patent Application WO2002081996
Kind Code:
A3
Abstract:
Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader (20) mounted to an electronics package comprises a central evaporator (28) in hydraulic communication with a peripheral condenser (30), both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator (28) substantially full at all orientations while leaving a void for accumulation of vapor in the condenser (30). A cover plate (24) and a parallel base plate (22) of generally similar dimension form the evaporator (28) and condenser (30). Optionally, an opening in the base plate (22) is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate (22) may be formed with the electronics package from a single piece of material. A boiling enhancement structure (34)is provided in the evaporator (30) to encourage vapor bubble nucleation.

Inventors:
JOSHI YOGENDRA
MURTHY SUNIL S
NAKAYAMA WATARU
Application Number:
PCT/US2002/010110
Publication Date:
December 12, 2002
Filing Date:
April 03, 2002
Export Citation:
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Assignee:
UNIV MARYLAND (US)
International Classes:
F28D15/02; F28F13/18; H01L23/427; (IPC1-7): F28D15/02
Foreign References:
US4550774A1985-11-05
US6167948B12001-01-02
DE10014625A12000-10-05
US5761037A1998-06-02
US6085831A2000-07-11
US2886746A1959-05-12
DE2947000A11980-07-17
US6164368A2000-12-26
US4036291A1977-07-19
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