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Title:
OUTER COVERING MATERIAL FOR VACUUM HEAT INSULATION MATERIALS, VACUUM HEAT INSULATION MATERIAL, AND ARTICLE WITH VACUUM HEAT INSULATION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/207470
Kind Code:
A1
Abstract:
The present disclosure provides an outer covering material for vacuum heat insulation materials, which comprises at least four resin layers, namely, a first resin layer, a second resin layer, a third resin layer and a fourth resin layer, and at least three gas barrier layers, and wherein: the first resin layer is a thermally weldable film; one or more of the gas barrier layers are arranged between the second resin layer and the third resin layer; and one or more of the gas barrier layers are arranged between the third resin layer and the fourth resin layer. This outer covering material for vacuum heat insulation materials has a tensile storage elastic modulus within the range of from 1.0 × 109 Pa to 1.5 × 109 Pa (inclusive) in an atmosphere having a temperature of 70°C and a humidity of 90% RH; the indentation elastic modulus of the second resin layer is not less than the indentation elastic modulus of the first resin layer; the indentation elastic modulus of the third resin layer is not less than the indentation elastic modulus of the second resin layer; and the indentation elastic modulus of the fourth resin layer is not less than the indentation elastic modulus of the third resin layer.

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Inventors:
MUNEDA TAKU (JP)
IMAI MASAHIRO (JP)
MIZOSHIRI MAKOTO (JP)
Application Number:
PCT/JP2018/010956
Publication Date:
November 15, 2018
Filing Date:
March 20, 2018
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
F16L59/065; B32B27/00; F16L59/02
Foreign References:
JP2007327619A2007-12-20
US20160230918A12016-08-11
JP2016117201A2016-06-30
JP2007040391A2007-02-15
JP2011226644A2011-11-10
JP2011226644A2011-11-10
JP4373797B22009-11-25
JP5568897B22014-08-13
Other References:
See also references of EP 3636978A4
Attorney, Agent or Firm:
YAMASHITA, Akihiko et al. (JP)
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