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Patent Searching and Data


Title:
OUTER PACKAGE MATERIAL FOR ELECTRICITY STORAGE DEVICES, AND ELECTRICITY STORAGE DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/013099
Kind Code:
A1
Abstract:
An outer package material for electricity storage devices according to the first embodiment of the present disclosure has a structure wherein at least a substrate layer, a bonding layer, a metal foil layer, a sealant bonding layer and a sealant layer are sequentially laminated in this order; and the bonding layer has an elongation at break of 45-200% and a yield stress of 3,500-6,500 N/cm2 in a stress strain curve that is obtained by a tensile test at a tensile rate of 6 mm/minute. An outer package material for electricity storage devices according to the second embodiment of the present disclosure has a structure wherein at least a substrate layer, a bonding layer, a metal foil layer, a corrosion inhibition treatment layer, a sealant bonding layer and a sealant layer are sequentially laminated in this order; and the bonding layer has a glass transition temperature of from 140°c to 160°C (inclusive).

Inventors:
SASAKI SATOSHI (JP)
MURAKI TAKUYA (JP)
YAMAZAKI TOMOHIKO (JP)
SUZUTA MASAYOSHI (JP)
Application Number:
PCT/JP2018/025571
Publication Date:
January 17, 2019
Filing Date:
July 05, 2018
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
B32B15/08; H01G11/78; H01M50/119; H01M50/121; H01M50/129; H01M50/131; H01M50/145; H01M50/133; H01M50/186; H01M50/193
Foreign References:
JP2015166261A2015-09-24
JP2015176764A2015-10-05
JP2017091767A2017-05-25
JP2016104565A2016-06-09
JP2013101765A2013-05-23
Other References:
See also references of EP 3654400A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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