Title:
OUTWALL THERMAL INSULATION BOARD
Document Type and Number:
WIPO Patent Application WO/2002/038879
Kind Code:
A1
Abstract:
The invention relates to a outwall thermal insulation board. It is comprised of foam thermal insulation board. The characteristics of the invention are that single face or double faces of the thermal insulation board have grid groove. After the adhesion material in the grooves have solid, it forms grid strengthen rib. There are glass-fibre grids, polymer cement mortar or compound resin sheet, decorate or protect sheet on the thermal insulation board. The thermal insulation board can be formed in situ or prefabricated.
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Inventors:
ZHANG MING (CN)
Application Number:
PCT/CN2001/000677
Publication Date:
May 16, 2002
Filing Date:
April 29, 2001
Export Citation:
Assignee:
ZHANG MING (CN)
International Classes:
B32B3/30; B32B5/18; B32B5/22; E04B1/76; E04B1/80; E04C2/04; E04C2/20; E04C2/22; E04C2/28; E04C2/284; E04C2/296; (IPC1-7): E04C2/04; E04C2/28; E04C2/284
Domestic Patent References:
| WO2000008271A1 | 2000-02-17 |
Foreign References:
| CN2325443Y | 1999-06-23 | |||
| CN2339649Y | 1999-09-22 |
Attorney, Agent or Firm:
BEIJING BEIXIN-ZHICHENG PATENT AGENT Co., LTD. (Xizhimen Nandajie Xicheng District Beijing 5, CN)
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