Title:
OXIDE BONDING MATERIAL AND JOINT USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/005312
Kind Code:
A1
Abstract:
Provided are a lead-free oxide bonding material and a joint using the same with which the component system is simple, operability and workability are good, the melting point is low and joint strength and air-tight sealability are excellent, and when a base or substrate having a different linear thermal expansion coefficient is bonded, heat resistance of 300ºC or greater, vacuum-tightness, and joint strength can be realized. The invention provides a bonding material formed from a solder alloy that is 0.005 to 2.0 wt% of Mg, 0.0005 to 1.0 wt% of Y, and substantially Sn as the balance; a bonding material obtained by mixing a lead-free, low-melting-point glass powder, polyether ether ketone or polyether sulfone resin powder, and the like with a powder of the solder alloy; and joints that use these bonding materials. As a result, it is possible to join oxide materials such as ceramics and glass or a variety of substrates having a surface oxide film without cracking or peeling, and a joint having excellent heat resistance, vacuum-tightness, and joint strength is obtained.
Inventors:
YAMADA MINORU (JP)
Application Number:
PCT/JP2011/065451
Publication Date:
January 10, 2013
Filing Date:
July 06, 2011
Export Citation:
Assignee:
SOPHIA PRODUCT CO (JP)
YAMADA MINORU (JP)
YAMADA MINORU (JP)
International Classes:
C03C27/10; B23K35/26; B23K35/363; C03C27/04
Domestic Patent References:
| WO2007007840A1 | 2007-01-18 |
Foreign References:
| JP2009101415A | 2009-05-14 | |||
| JP2009119528A | 2009-06-04 | |||
| JP2005254298A | 2005-09-22 |
Attorney, Agent or Firm:
NAKAYAMA, Mitsuko et al. (JP)
Nakayama Photon (JP)
Nakayama Photon (JP)
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Claims: