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Title:
OXIDE SUPERCONDUCTING THIN FILM WIRE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2015/133505
Kind Code:
A1
Abstract:
An oxide superconducting thin film wire which comprises a metal substrate, a laminate and a Cu stabilization layer. The metal substrate is provided with a supporting base and a conductive layer that is arranged on the supporting base. The conductive layer comprises a Cu layer serving as an inner layer and a surface layer that is biaxially oriented. The laminate is obtained by sequentially laminating, on the metal substrate, an intermediate layer, an oxide superconducting layer and an Ag stabilization layer in this order from the metal substrate side. The Cu stabilization layer is formed so as to cover the peripheries of the laminate and the metal substrate. The Cu stabilization layer and/or the Ag stabilization layer is formed to be in contact with at least a part of the conductive layer of the metal substrate so as to be electrically connected with the conductive layer of the metal substrate.

Inventors:
YAMAGUCHI, Takashi (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
NAGAISHI, Tatsuoki (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
KONISHI, Masaya (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
OHKI, Kotaro (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
HONDA, Genki (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
Application Number:
JP2015/056296
Publication Date:
September 11, 2015
Filing Date:
March 04, 2015
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES,LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
International Classes:
H01B12/06; C01G1/00; C01G3/00; H01B13/00; H01F6/06; H01L39/24
Foreign References:
JP2013122065A2013-06-20
JP2011040378A2011-02-24
JP2009218008A2009-09-24
JP2005044636A2005-02-17
JP2011113664A2011-06-09
Attorney, Agent or Firm:
NAKATA, Motomi et al. (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
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