The present invention relates to novel epoxy resins which are flame resistant prepared from an oxirane containing phosphonate of the formula:

, wherein R is hydrogen or lower alkyl, R, is lower alkyl and y is 1 to 3 , and wherein in the oxirane group of the phosphonate reacts with a functional substituent in the backbone of the epoxy resin. In particular the present invention relates to epoxy resins prepared from dimethyl (oxiranylmethyl) phos¬ phonate wherein the backbone of the epoxy resin con- tains a hydroxyl group, preferably substituted in an alkylene group as the functional substituent.

U.S. Patent No. 2,627,521 to Coover (1953) describes the use of oxirane containing phosphoήates in cellulose derivatives and polyvinyl resins as plasticizers and stabilizers. The phosphonates are also indicated to be polymerizable. The literature describes numerous uses of phosphorus containing organic compounds with polyurethane and epoxy resins for imparting flame resistance. It is believed that the prior art does not describe the use of phosphon- ates (I) which react with a functional substituent in the backbone of the epoxy resin.

The present invention provides a process for preparing a flame resistant epoxy resin wherein the backbone of the epoxy resin contains a functional substituent which is reacted with an oxirane contain¬ ing phosphonate. The present invention also provides, novel epoxy resins which are flame resistant and which exhibit unexpectedly high glass temperatures (Tg). Employing the process of the present invention flame resistant epoxy resins are prepared in a simple and economical manner.

Figure 1 is a graph showing the Limiting Oxygen Index (LOI) as a function of dimethyl (oxi- ranyl) methyl phosphonate (DMOMP) concentration in

® DDEERR® 333311 wwhhiicch contains hydroxy alkylene groups in the backbone.

Figure 2 is a graph showing glass temper¬ ature (Tg) as a function of the concentration of DMOMP in DER® 331.

The present invention relates to a process for preparing a cured epoxy resin having.improved flame resistance characterized by reacting the admixture of an uncured di- or polyepoxide having a backbone which contains a functional substituent which is reactive with an oxirane group, a curing agent and an oxirane group containing phosphonate of the formula:

wherein the oxirane group is reactive with the functional substituent, R is hydrogen or a lower alkyl group, R-. is a lower alkyl and y is

1,2 or 3, at elevated temperatures to produce the cured epoxy resin which is flame resistant.

The present invention also relates to a curable epoxy resin formulation which comprises: (a) a liquid di- or polyepoxide composition curable with a curing agent at elevated temperatures wherein the di- or polyepoxide has a backbone which contains a functional substituent which is reactive with an oxirane group; and (b) an oxirane group containing phosphonate of the formula

/ ^0Rl R-CH-CH-(CH )yP (I)

\ / ^b \ 0 OR- _j^

wherein the oxirane is reactable with the functional substituent, R is hydrogen or a lower alkyl group, R.. is a lower alkyl group and y is 1, 2 or 3, and wherein the compositions contains between 1 and 20 percent by weight of the phosphonate and wherein the phosphonate imparts enhanced flame resistance to the epoxy resin formulation when cured. The present invention also relates to -the above epoxy resin formulation which included a curing agent. Finally the present invention includes the cured epoxy resins prepared with the phosphonate (I) .

The oxirane containing phosphonates (I) are prepared by known processes. The general process of U.S. Patent No. 2,627,521 of Coover can be used to prepare these compounds. In the preferred compounds, R-. is a lower alkyl group containing 1 to 4 carbon atoms and R is lower alkyl containing 1 to 4 carbon atoms or hydrogen. R being hydrogen is preferred. It is also preferred that R_ is methyl. As previously indicated, the most preferred compound is dimethyl (oxiranylmethyl) phosphonate which is also known as dimethyl-2,3-epoxypropyl phosphonate.

Epoxy resins are generally described in Kirk-Othmer Vol. 9, pages 267 to 289 (1980). The literature describing epoxy resins is extensive and only requires a general summary here. This class of resins includes di- and polyepoxides which are cured with catalytic or reactive curing curing agents. The backbones of the di- or polyepoxides

can be aliphatic, cycloaliphatic, aromatic or hetero- cyclic and can include functional groups in the backbone which react with an oxirane group of the phosphonate (I) such as hydroxy, acidic ether, ester, amide and imide groups. An epoxy group in the backbone of a polyepoxide can also react with the phosphonate (I) and not interfere with the curing of the polyepoxide.

The catalytic curing agents include Lewis acids and bases which initiate homopolymerization. The boron trifluoride a ine catalysts are the most common. The coreactive catalysts are polyfunctional compounds containing active hydrogens which react with the epoxy groups. Polyamines are a common class of such coreactive curing agents.

The preferred diepoxide has the formula:

H ₂

wherein n is a number between 0 and 40. This class of diepoxides includes DER 331 (Dow Chemical Company,

Midland, Michigan) which is a partial hydrolyzate of (II) where the average value of n is 0.15. The pre¬ ferred range is between 0 and 0.15. The preferred range is between 0.15. U.S. Patent No. 4,164,487 to Martin describes this class of epoxy resins. The backbone of these epoxy resins has a secondary hydroxyl substituent in the alkylene -CH ₂ CH(0H)- group which is reactive with the oxirane group con¬ taining phosphonate (I) of the present invention.

U.S. Patent No. 4,364,496 to Schrader describes preferred polyglycidyl ethers of tris (hydroxyphenyl)alkanes which include a secondary hydroxyl substituent in the alkylene (-CH ₂ CH(0H)-) group of the backbone which is reactive with the oxirane group containing phosphonate '(I) . Preferred oligomers have the formula:

wherein m is 0 , 1 or 2.

Patent No. 4,256,844 to Martin also describes other epoxides having hydroxy, alkoxy alkyl and hydroxy alkyl groups in the aromatic rings as substituents in the backbone of the epoxy resin which are reactive with the oxirane phosphonate (I) . These are com- mercially available resins including Apogen ® Shaefer Chemicals, Inc., Riverton, New Jersey, Methylon ®

Resin 75108 sold be general Electric and described in U.S. Patent No. 2,965,607 to Martin. Other epoxy resins of this type are described in U.S. Patent

Nos. 3,035,021 to Howe, 3,859,255 to Heer and U.S.

Patent No. 4,394,469 to Schrader.

The epoxy resins _. can be modified to include amide (-C0NH ₂ ) and imide (-C0-NH-C0-) groups which are reactive with the oxirane phosphonate (I) . The hydantoin epoxy resins and triazine epoxy resins include carbonyl and epoxy groups which can be hydrolyzed to hydroxy groups which are reactive with the oxirane phosphonate. Numerous variations will occur to those skilled in the art.

Examples 1 to 11 Epoxy resms were prepared from DER ® 331

(epoxy equivalent weight 189) and methylenedianiline, MDA, (epoxy equivalent weight 49.47). DMOMP (epoxy equivalent weight 166.11) was prepared by an Arbuzov reaction (Merck Index, Eight Edition, page ONR60 and

61 (1976)) between trimethyl phosphite and epibromo- hydrin which is esentially described in U.S. Patent No3 2,627,521 to Coover. After vacuum distillation the product refractive index was 1.4462 at 23.0°C.

The mixtures described in Table I were pre¬ pared at approximately 100°C. The ratio of the methyl- enedianailine equivalents to total epoxy equivalents was kept constant at 0.90 for comparative purposes. The mixtures were poured into a brass mold approximately 1/8" (0.32 cm) thick and heated in an air-circulating oven at 103-104°C for 2.0 to 2.7 hours followed by heating at 182-185°C for 17 to 21 hours. Samples that contained 25 to 30 percent DMOMP were heated for longer times at lower temperatures and then slowly heated up to the final cure temperature. Limiting oxygen index (LOI) values were obtained on specimens (3 to 4 x 6 to 7 x 60 to 70 m) according to ASTM Desig¬ nation D-2863-70. This method tests ^' the burning of a sample as a function of increasing oxygen con- concentrations in nitrogen. Glass temperatures (Tg) were obtained at a heating rate of 20°C/min. using a Perkin-Elmer differential scanning calorimeter, Model DSC-1B.

Table I describes the composition, LOI, and Tg of epoxy resins prepared from DER ® 331,

DMOMP, and MDA. Resins were prepared containing up to 30 percent by weight DMOMP.

TABLE I COMPOSITION AND PROPERTIES OF EPOXY RESINS CONTAINING DMOMP

® DER 331 DMOMP MDA

Example Wgt. (g) Cone. Wgt. (g) Cone. gt. (g) Cone. L0I ^a τ _B ^b

1 41.1 80.92% 9.694 19.08% 27.0 ± 0.0 139.0 ± 1.0°!

2 66.002 80.90 — -- 15.580 19.10

3 41.353 78.32 1.524 2.52% 11.587 19.16 29.0 ± 0.9 171.8 ± 3.7

4 ^• 46.128 75.77 3.047 5.01 11.707 19.23 28.3 ± 0.5 185.6 ± 1.1

5 43.632 70.64 6.810 10.01 11.958 19.36 29.7 ± 1.3 179.0 ± 1.3

6 40.470 65.49 9.283 15.02 12.046 19.49 36.8 ± 0.9 177.9 ± 1.8

7 60.705 64.48 13.935 15.-03 18.073 19.49

8 37.234 60.35 12.354 20.02 12.107 19.62 41.7 ± 1.7 152.4 ± 2.2

9 20.005 55.25 9.052 25.00 7.154 19.76 41.5 ± 1.4 106.3 ± 8.2

10 20.010 50.12 11.972 29.99 7.939 19.89

11 20.009 50.09 11.996 30.03 7.938 19.87

_j i Limiting oxygen index, % oxygen.

Glass temperature determined at a scanning rate of 20°C/min.

See Table II for tensile properties.

See Figure 3.

Heated slowy from 95 to 183 1/3°C for 3 1/4 hours; then heated at 183 1/2°C for

19 1/2 hours.

Heated slowy from 94 to 185°C for 3 3/4 hours; then heated at 185°C for 16 1/2 hodrs.

Figure 1 which plots the results of Table 1 shows the increase in LOI of the epoxy resin with increasing concentration of DMOMP. The straight line is at least squares fit for the seven points: LOI (percent 0 ₂ ) = 0.657 (DMOMP, weight percent) + 26.15; (r = 0.96). Figure 2 shows the change in glass temperature (Tg) with DMOMP concentration. Copolymerization of small amounts of DMOMP into the resin resulted in an increase in Tg from 139°C to a .maximum of about 186°C. When the concentration of DMOMP was increased above 15 weight percent, the Tg dropped sharply until it was 106°C at 25 percent DMOMP. The peak in Tg occurred at 5 to 15 percent DMOMP content. The reason for the increase and the peak in Tg with increasing DMOMP concentration is not known. The DMOMP may be reacting and copolymerizing not only through the oxiranyl .group but also through the two .POCH ₃ groups, possibly with the elimination of methanol; a "tighter" and more highly cross-linked network might thus be obtained with accompanying increase in glass temperature.

Table II lists some common tensile pro-

® perties for an epoxy resin prepared from DER 331 and MDA and for a similar one containing 15 weight percent of the DMOMP reacted with the DER 331.

TABLE II

TENSILE PROPERTIES OF EPOXY RESINS

DMOMP ,b Tensilec u, c e d

Example Concentration Strength ' Elongation ' Modulus 2 8510±1780 8.512.2 201700174900

(58674112272) (13906721516417)

15 39201620 4.611.4 222300130600 (2702714275) (15327041210979)

See Table I.

Weight percent.

At break.

Pounds per square inch (kPa)

Percent.

The "1" designates the standard deviation

The presence of the .fire retardant results . in a loss in tensile strength of about fifty percent at fifteen percent DMOMP. DMOMP: also results in some- what lower elongation and a- slightly higher modulus. These observations are consistent with an increase in cross-link density and in glass temperature. The monofunctional nature of DMOMP most likely contributes to the reduced tensile strength. These properties do not interfere with.the usefulness of the cured epoxy resins of the present invention in most use settings where tensile strength is not relied upon. _.

The heating of compositions containing DMOMP needed to be carried out with caution, since

DMOMP undergoes vigorous reaction and decomposition at temperatures in excess of 150°C to give a black water and toluene soluble char. At 100°C, mixtures of DE ® 331 and MDA that contained greater than 20 percent DMOMP produced a vigorous and exothermic decomposition/polymerization to give a black, swollen, foamed, and charred solid; the reaction was especially vigorous and more apt to occur in thicker sections or in other geometries where heat conduction was poor. Resins that contained 25 to 30 percent DMOMP (Examples 9, 10 and 11, Table I) were prepared by starting the polymerization reaction at temperatures below 100°C followed by a slow and regulated temperature increase to the final curing temperature of 183 to 185°C. Compositions containing greater than 25 percent DMOMP (Examples 10 and 11, Table I) contained large numbers of flat, opaque, and dark discs measuring 3 ^' to 5 mm diameter. These resins were brittle and had dimpled surfaces where the discs touched the sur- face. The composition of the discs is not known.

A violent reaction was observed between DMOMP, 10 g, and MDA, 2.7 g, in an aluminum weighing dish within five minutes at 105 to 110°C. The color of the clear, cured resins became progessively darker with increas- ing DMOMP concentration.

Epoxy resins containing no DMOMP burned in 27 percent oxygen giving a fluffy soot with a negli¬ gible amount of char formation. The present of DMOMP resulted in a stiff free-standing and voluminous char. The presence of 20 to 25 percent DMOMP resulted in ^: a resin that ignited and burned with difficulty; the composition burned erratically with sputtering.

As can be seen from the preceding Examples, Dimethyl(oxiranylmethyl)phosphonate, DMOMP, was found to be an effective fire retardant when copolymerized with DE ® 331 and a curing agent such as methylene- dianiline to produce a cured epoxy resin. A maximum in beneficial effect was observed at a concentration of about 15 weight percent DMOMP; the LOI increased from 27 to 37 percent oxygen, and the glass tempera¬ ture increased from 139 to 178°C. Tensile strength, at 15 percent DMOMP, suffers, but elongation and modulus were not affected significantly. At concen¬ trations of DMOMP in excess of 20 percent the bene¬ fits from increased fire resistance were offset by decreases in glass temperature and by difficulties in controlling the curing reaction.

The oxirane containing phosphonates (I ) are preferably provided in the epoxy resin in an - amount between 1 to 20 percent by weight of the resin, most preferably between 2 and 15 percent by weight. This provides usable cured epoxy resins.

DMOMP is a monofunctional compound that contains only one reactive group, the oxiranyl ring. Such compounds are known in polymer chemistry as "end-blocking" or chain terminating materials that control the polymer chain length or molecular weight. The higher the concentration of chain terminator the lower the molecular weight of the resulting polymer. Lower molecular weights are accompanied by poorer physical properties, e.g. tensile strength and glass temperature. Surpris¬ ingly the resins containing DMOMP have higher glass temperatures (up to 22 percent DMPMP concentration). Other phosphonates (I) can produce the same results.