Title:
PROCESS FOR PRODUCTION OF OLIGO&lpar METH&rpar ACRYLATE−CONTAINING RESIN COMPOSITIONS&semi CATALYST TO BE USED IN THE PROCESS, AND OLIGO&lpar METH&rpar ACRYLATE−CONTAINING RESIN COMPOSITIONS PRODUCED BY THE PROCESS
Document Type and Number:
WIPO Patent Application WO/2003/000768
Kind Code:
A1
Abstract:
An oligo(meth)acrylate−containing resin composition is produced by subjecting a composition comprising (meth)acrylic acid, an alkylene monoepoxide, and a polybasic acid anhydride, a composition obtained by adding a polybasic acid anhydride to a composition containing an unsaturated alcohol prepared by reacting (meth)acrylic acid with an alkylene monoepoxide, or a composition which is prepared by reacting (meth)acrylic acid with an alkylene monoepoxide and a polybasic acid anhydride and contains an unsaturated oligomer bearing an unsaturated group and a hydroxyl group to reaction with a catalyst containing an organic and&sol or inorganic antimony compound at a temperature of 140 to 210 ºC.
Inventors:
TAKIYAMA EIICHIRO
YOSHIMURA SUSUMU
OTSUKA SHINICHI
YOSHIMURA SUSUMU
OTSUKA SHINICHI
Application Number:
PCT/JP2002/006125
Publication Date:
January 03, 2003
Filing Date:
June 19, 2002
Export Citation:
Assignee:
DJK LAB INC (JP)
SHOWA DENKO KK (JP)
SHOWA DENKO KK (JP)
International Classes:
C08G63/58; C08G63/86; (IPC1-7): C08G63/58
Foreign References:
| JPH08245729A | 1996-09-24 | |||
| JPH0641283A | 1994-02-15 |
Attorney, Agent or Firm:
Ishida, Takashi (ISHIDA & ASSOCIATES Toranomon 37 Mori
Bldg. 5-, Toranomon 3-chome Minato-ku Tokyo, JP)
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