Title:
PACKAGE ACCOMMODATING HEAT-DISSIPATING SUBSTRATES, AND PACKAGING BOX
Document Type and Number:
WIPO Patent Application WO/2020/100686
Kind Code:
A1
Abstract:
A package (100) according to the present invention is provided with: a plurality of heat-dissipating substrates (10) that are stacked on top of each other; intermediate sheets (20) that are each arranged under the lowermost heat-dissipating substrate, over the uppermost heat-dissipating substrate, and between adjacent heat-dissipating substrates; a drying agent (30) that is arranged above or below the plurality of heat-dissipating substrates; and a bag (50) that seals the plurality of heat-dissipating substrates, the plurality of intermediate sheets, and the drying agent.
Inventors:
OTA HIROAKI (JP)
ISHIHARA YOSUKE (JP)
GOTO DAISUKE (JP)
ISHIHARA YOSUKE (JP)
GOTO DAISUKE (JP)
Application Number:
PCT/JP2019/043482
Publication Date:
May 22, 2020
Filing Date:
November 06, 2019
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B65D77/04; B65D81/26; B65D85/86
Foreign References:
| JP2007269391A | 2007-10-18 | |||
| JPH01202436A | 1989-08-15 | |||
| JP2009096155A | 2009-05-07 | |||
| JPH11139889A | 1999-05-25 | |||
| JPH11116361A | 1999-04-27 | |||
| JP2007314236A | 2007-12-06 | |||
| JP2017132480A | 2017-08-03 | |||
| JP2015161026A | 2015-09-07 | |||
| JPH0551072A | 1993-03-02 | |||
| JP2018213469A | 2018-11-14 |
Other References:
See also references of EP 3882177A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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