PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE PROVIDED WITH SAME, AND ELECTRONIC DEVICE

Title:

PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE PROVIDED WITH SAME, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2013/015216

Kind Code:

A1

Abstract:

A package for accommodating a semiconductor element according to one embodiment of the present invention is provided with: a base having a mounting region on which the semiconductor element is mounted on the upper surface; a frame body having a frame shaped part provided on the upper surface of the base so as to surround the mounting region and opening parts passing through from the inside of the frame shaped part to the outside of the frame shaped part; flat sheet shaped insulating members provided in the opening parts and extending from the inside of the frame body to the outside of the frame body; a plurality of wiring conductors provided on the upper surface of the insulating members and extending from the inside of the frame body to the outside of the frame body; and a metal film provided on the upper surface of the insulating members and outside of the frame body, continuing so as to surround the plurality of wiring conductors.

Inventors:

TSUJINO MAHIRO (JP)
MIYAHARA MANABU (JP)

Application Number:

PCT/JP2012/068436

Publication Date:

January 31, 2013

Filing Date:

July 20, 2012

Export Citation:

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Assignee:

KYOCERA CORP (JP)
TSUJINO MAHIRO (JP)
MIYAHARA MANABU (JP)

International Classes:

H01L23/04

Domestic Patent References:

WO2009057691A1

2009-05-07

Foreign References:

JP2009010149A	2009-01-15
JPS63216366A	1988-09-08

Other References: