A PACKAGE ASSEMBLY AND PRODUCTION METHOD THEREOF TECHNICAL FIELD

The present invention relates to a package assembly and the production method thereof developed for solving the problems occurring as a result of contact of the materials used in structures which prevent humidity and oxygen penetration into products like food, detergent, etc. preserved inside packages.

PRIOR ART

In package production, lamination operation is the operation where two films are adhered to each other by means of an adhesive. In the present art, preferably, package assembly with 3 layered laminate structure is used. In this assembly, there is a layer, printed at the topmost layer facing the outer medium, and there is a layer in the middle having metalized surface, and there is an inner layer made of polymer-based material and contacting the product at the bottom. Preferably aluminum is used as the metal surface material of the metalized layer. In practice, the printed layer and the aluminum surface of the metalized layer are first of all laminated to each other, and afterwards, it is used by being laminated with the inner layer, however, in this method, the ink of the printed layer or the components of the print surface may act on the aluminum surface and may dissolve the aluminum surface. In the structures produced as a result of this, delamination may occur as a result of the weakness between the plastic surface and the aluminum layer of the plastic film having aluminum surface. As a result of this delamination, the product, placed into the package, cannot be kept with the desired and designed properties.

As a result, because of all of the abovementioned problems, an improvement is required in the related technical field.

BRIEF DESCRIPTION OF THE INVENTION

The present invention relates to a package assembly, for eliminating the above mentioned disadvantages and for bringing new advantages to the related technical field. The main object of the present invention is to provide a package assembly which is prevented from being delaminated.

Another object of the present invention is to provide a package assembly where the binding force between the lamination layers is increased.

In order to realize all of the abovementioned objects and the objects which are to be deducted from the detailed description below, the present invention is a package assembly comprising a metalized layer having a metalized surface and a first adhesion surface; an inner layer having an outer surface and an adhesion surface connected to said metalized layer. Accordingly, said invention is characterized in that the metalized surface and the inner layer are positioned in a manner facing each other. Thus, the inner layer protects the metalized surface from physical and chemical effects by forming a barrier to the metalized surface.

In a preferred embodiment of the subject matter invention, there is an adhesion surface where the inner layer is connected to the metalized surface.

In another preferred embodiment of the subject matter invention, there is a second adhesion layer positioned between the metalized surface and the adhesion surface.

In another preferred embodiment of the subject matter invention, there is a print layer connected to the first adhesion surface. Thus, the print layer will contact the first adhesion surface, and the ink, provided on the print layer, is prevented from affecting the metalized surface.

In order to realize all of the abovementioned objects and the objects which are to be deducted from the detailed description below, the present invention is a production method of a package assembly comprising a metalized layer having a metalized surface and a first adhesion surface; an inner layer having an outer surface and an adhesion surface connected to said metalized layer. Accordingly, said invention is characterized in that said metalized layer and said inner layer are connected such that said metalized surface and said inner layer face each other in a manner obtaining duplex laminated structure. In another preferred embodiment of the subject matter invention, the metalized surface is connected to an adhesion surface. In another preferred embodiment of the subject matter invention, the duplex laminated structure obtained is connected to a print layer. Thus, the information of the product where the package is used is placed on the package. In another preferred embodiment of the subject matter invention, the print surface of the print layer is connected to the first adhesion surface of the metalized layer which is in duplex laminated structure.

In another preferred embodiment of the subject matter invention, the print surface and the first adhesion surface are connected through a first adhesion layer.

BRIEF DESCRIPTION OF THE FIGURES

Figure 1 is a general view of the package assembly.

REFERENCE NUMBERS

10 Print layer

1 1 Print film

12 Print surface

102 First adhesive layer

20 Metalized layer

21 First adhesion surface

22 Metalized surface

202 Second adhesive layer

30 Inner layer

31 Second adhesion surface

32 Outer surface THE DETAILED DESCRIPTION OF THE INVENTION

In this detailed description, the subject matter package assembly is explained with references to examples without forming any restrictive effect only in order to make the subject more understandable.

With reference to Figure 1 , the subject matter package assembly comprises a print layer (10); a metalized layer (20) connected to said print layer (10) through a first adhesive layer (102); an inner layer (30) connected to said metalized layer (20) through a second adhesive layer (202).

On the surface of the print layer (10) facing the outer medium, there is a print film (1 1), a print surface (12) on the surface facing the first adhesive layer (101). The print film (1 1) is formed by a polymer structured material. Preferably, polyethylene terephthalate or polypropylene is used. The print surface (12) is formed by means of printing the information of the product, forming the outer section of the package, onto the print film (11). In the preferred application, the print film (1 1) has a transparent structure.

The metalized layer (20) comprises a first adhesion surface (21) and a metalized surface (22) coated by means of subliming and adhering the metal material onto said first adhesion surface (21). The first adhesion surface (21) is made of a polymer based material. In the preferred application, polyethylene terephthalate or polypropylene is used. Again in the preferred application, preferably aluminum is used as the metal material on the metalized surface (22). During the metalized surface (22) formation process, while preferably the first adhesion surface (21) passes through the aluminum blocks, the aluminum blocks are sublimed, and thus, the first adhesion surface (21) is coated with aluminum. The first adhesive layer (102) is positioned between the print surface (12) of the print layer (10) and the first adhesion surface (21) of the metalized layer (20).

The inner layer (30) consists of at least one layer. In the alternative embodiment of the present invention, the inner layer (30) may also be formed by pluralities of layers. On the side of the inner layer (30) facing the metalized layer (30), there is a second adhesion surface (31) and there is an outer surface (32) provided on the side facing the product. The second adhesive layer (202) is positioned between said second adhesion surface (31) and the metalized surface (22).

In practice, the metalized surface (22) of the metalized layer (20) and the inner layer (30) are adhered to each other. Thus, the aluminum material coated onto the metalized surface (22) is preserved against external factors, and it is prevented from being damaged by physical and/or chemical factors. Preferably, after the metalized layer (20) is laminated with the inner layer (30), the duplex laminated structure obtained may also be laminated by means of another layer and/or a number of other layers.

In case the duplex layer is laminated with the print layer (10) which is the other layer, first of all, the product information is printed onto the print surface (12) of the print layer (10). Afterwards, lamination process is applied by means of the duplex laminated structure. Thus, the metalized surface (22) is diverged from the print surface (12), and the ink, provided on the print surface (12), is prevented from damaging the metalized surface (22). The application steps of the laminated structure with at least 2 layers during the lamination with the print layer (10) are as follows;

Printing the product information onto the print surface (12) of the print layer,

Obtaining the duplex laminated structure by adhering the metalized surface (22) and the second adhesion surface (31) by means of the second adhesive layer (202), Adhering the print surface (12) and the first adhesive surface (21), provided in the duplex laminated structure obtained, by means of the first adhesive layer (102)

As a result of the abovementioned details, a package assembly, which is in triple laminate structure, is obtained. Moreover, optionally, the arrangement of the steps (a) and (b) can be changed. Here, it is important that step (b) is realized before step (c).

In step (b), in case the metalized surface (22) is used in a manner replacing the first adhesive surface (21), and the first adhesive surface (21) is used in a manner replacing the metalized surface (22), said metalized surface (22) can be drawn during package production, and as a result of the contact of the metalized surface (22) and the print surface (12), the delamination of the package is facilitated after step (c). However, by means of the production manner described above, the metalized surface (22) is protected against external factors by means of the second adhesion surface (31).

The protection scope of the present invention is set forth in the annexed Claims and cannot be restricted to the illustrative disclosures given above, under the detailed description. It is because a person skilled in the relevant art can obviously produce similar embodiments under the light of the foregoing disclosures, without departing from the main principles of the present invention.