Title:
PACKAGE BOARD, MOTHER BOARD, ELECTRONIC COMPONENT, AND ACOUSTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/094283
Kind Code:
A1
Abstract:
Provided is a package board whereby direction discrimination can be reliably performed without making manufacturing steps complicated.
An acoustic wave element 4 as an electronic component element is mounted on a package board 2. A plurality of electrode pads 3a-3f are provided on a first main surface 2a of the package board 2, and the acoustic wave element 4 is bonded. The planar shape of at least one electrode pad 3a among the electrode pads 3a-3f is different from the planar shapes of other electrode pads 3b-3f.
Inventors:
KOREEDA TOSHISHIGE (JP)
Application Number:
PCT/JP2016/070789
Publication Date:
June 08, 2017
Filing Date:
July 14, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01L23/00; H03H9/25; H05K1/02
Foreign References:
| JP2013145932A | 2013-07-25 | |||
| JP2003017819A | 2003-01-17 | |||
| JP2009146969A | 2009-07-02 | |||
| JPS6090863U | 1985-06-21 | |||
| JPS5873182A | 1983-05-02 | |||
| JP2003017619A | 2003-01-17 | |||
| JP2012235149A | 2012-11-29 | |||
| JP2003008186A | 2003-01-10 | |||
| JP2007189044A | 2007-07-26 | |||
| JPH0513900A | 1993-01-22 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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