Title:
PACKAGE BODY, PLASMA IRRADIATION MODULE, AND PLASMA IRRADIATION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/084717
Kind Code:
A1
Abstract:
A package body (1) comprises a detachable part (12), a packaging material (2) for packaging the detachable part (12), and an information unit (first information unit (60B)). The information unit contains information readable by a control device (50). The information unit includes at least one of a memory unit (first memory unit (60C)) that stores the number of uses of the detachable part (12) and an identification unit (first identification unit (60D)) on which identification information relating to the detachable part (12) is written. The information unit is provided on at least one of the detachable part (12), the packaging material (2), and the inside of the packaging material (2).
Inventors:
NAKANO YOSHIHIRO (JP)
MATSUMOTO YUJI (JP)
TAKAHASHI KEI (JP)
MATSUMOTO YUJI (JP)
TAKAHASHI KEI (JP)
Application Number:
PCT/JP2022/044534
Publication Date:
April 25, 2024
Filing Date:
December 02, 2022
Export Citation:
Assignee:
NITERRA CO LTD (JP)
International Classes:
H05H1/26; A61C19/06
Attorney, Agent or Firm:
GRANDOM PATENT LAW FIRM (JP)
Download PDF: