Title:
PACKAGE BOX ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2023/234580
Kind Code:
A1
Abstract:
According to various embodiments, a package box assembly comprises: a first box including a first plate portion and a first accommodation portion formed through a first side wall extending to a designated height along the edge of the first plate portion; a second box including a second plate portion and a second accommodation portion formed through a second side wall extending to a designated height along the edge of the second plate portion, the second box being at least partially accommodated in the first accommodation portion; a cover member for covering the rear surface of the package box assembly when the first box and the second box are coupled; and an engagement structure for fixing the cover member to the second box, wherein the engagement structure may comprise at least one engagement portion formed on at least a part of the cover member, and at least one engagement groove formed to accommodate the engagement portion at a corresponding position of the second box.
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| JP2007076685 | BAG-IN BOX |
Inventors:
LEE OHHEE (KR)
YOON BYOUNGUK (KR)
YOON BYOUNGUK (KR)
Application Number:
PCT/KR2023/006361
Publication Date:
December 07, 2023
Filing Date:
May 10, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
B65D5/60; B65D5/44; B65D5/66; B65D81/02; B65D85/38
Foreign References:
| KR20080006651U | 2008-12-31 | |||
| JPH07315370A | 1995-12-05 | |||
| KR20190115673A | 2019-10-14 | |||
| JP2002538050A | 2002-11-12 | |||
| KR200428399Y1 | 2006-10-16 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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