Title:
PACKAGE COMPONENT
Document Type and Number:
WIPO Patent Application WO/2011/099356
Kind Code:
A1
Abstract:
Disclosed is a package component which is free from problems due to positional shifts of a plurality of electronic components contained within the package by solving the problem of agglomeration of adhesives.
Specifically disclosed is a package component (101) which comprises a package main body (22) and a sensor chip (30) and an IC chip (31) that are contained within the package main body (22). The package main body (22) comprises a hollow part (23) that is configured of the inner bottom surface and the inner side wall. The inner bottom surface of the package main body (22) is provided with a recessed portion (24). The sensor chip (30) is bonded and fixed to the recessed portion (24) with a first adhesive (33). The IC chip (31) is bonded and fixed to a region other than the recessed portion (24) with a second adhesive (34).
Inventors:
WATANABE MASANOBU (JP)
OKADA MANABU (JP)
OKADA MANABU (JP)
Application Number:
PCT/JP2011/051279
Publication Date:
August 18, 2011
Filing Date:
January 25, 2011
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
MIYOSHI ELECTRONICS CORP (JP)
WATANABE MASANOBU (JP)
OKADA MANABU (JP)
MIYOSHI ELECTRONICS CORP (JP)
WATANABE MASANOBU (JP)
OKADA MANABU (JP)
International Classes:
H01L23/08; G01C19/5783; G01P15/08; H01L23/04; H01L25/00
Foreign References:
| JP2010021519A | 2010-01-28 | |||
| JPH03289528A | 1991-12-19 | |||
| JPH01241828A | 1989-09-26 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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Claims:
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