Title:
PACKAGE FOR ELECTRONIC COMPONENT STORAGE, ELECRONIC DEVICE, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/110728
Kind Code:
A1
Abstract:
The present invention addresses the technical problem of providing a sealing ring comprising a metallic brazing material layer on one surface of a base material including Kovar and a metal plating layer on the other surface, the sealing ring being capable of preventing the occurrence of stains to the surface of the metal plating layer and capable of achieving excellent air tightness of a package for electronic component storage. The present invention solves this technical problem with an annular sealing ring comprising a nickel layer on a first surface of the base material that includes Kovar (iron-nickel-cobalt alloy) and the metallic brazing material layer on a second surface that is opposite the first surface, wherein a thickness of the nickel layer is 0.1 µm-20µm.
Inventors:
TAKEOKA HARUMI (JP)
YOSHIDA KAZUHARU (JP)
IDO RYUTA (JP)
TAKEUCHI JUNICHI (JP)
YOSHIDA KAZUHARU (JP)
IDO RYUTA (JP)
TAKEUCHI JUNICHI (JP)
Application Number:
PCT/JP2016/087745
Publication Date:
June 29, 2017
Filing Date:
December 19, 2016
Export Citation:
Assignee:
KYOCERA CORP (JP)
TANAKA PRECIOUS METAL IND (JP)
TANAKA PRECIOUS METAL IND (JP)
International Classes:
H03H9/02; H01L23/02; H01L23/10; H03H3/02
Foreign References:
| JP2011119338A | 2011-06-16 | |||
| JP2009140784A | 2009-06-25 | |||
| JP2002030393A | 2002-01-31 | |||
| JP2004063960A | 2004-02-26 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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